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Third Electronics System Integration Technology Conference ESTC hosted by Fraunhofer IZM
The Electronics System Integration Technology Conference has established itself as one of Europe’s most important packaging events. The third ESTC conference will be taking place at the Maritim pro arte Hotel in Berlin from September 13-16, 2010. more...

3D Heterointegration
How can multi-sensor modules be even further miniaturized at considerably reduced manufacturing cost? more...

Fraunhofer IZM’s Rolf Aschenbrenner is new CPMT president
IZM-scientist Rolf Aschenbrenner has been elected president of the IEEE CPMT Board of Governors. The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of advances in microsystems packaging and manufacture.

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