System Integration in Micro Electronics - SMT 2017

From May 16 - 18, 2017 the SMT Hybrid Packaging – Europe’s leading trade fair for System Integration in Micro Electronics – takes place in Nürnberg. Current products, services and innovations in the field of electronic manufacturing from a wide and international range will be presented to the public. Main topics are design and development, PCB production, components, assembly, soldering, packaging and test systems.

We cordially invite you to visit Fraunhofer IZM in Hall 6!

There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies.

Your Voucher for a free entry to SMT Hybrid Packaging 2017

  1. Visit: www.smthybridpackaging.com/tickets
  2. Register with the following online registration number: 1712325389
  3. Via email you will receive your personal season entry ticket free of charge
  4. Please bring the printed ticket to the exhibition

Download instructions pdf here:

Voucher SMT2017 (pdf/0.31MB)



CPMT’s German chapter cooperates with SMT HYBRID PACKAGING 2017!

The German CPMT Chapter has started a collaboration with Europe’s most important congress and exhibition in the realm of system integration, the SMT HYBRID PACKAGING. This year the event will be taking place in Nürnberg from May 16-18, 2017. CPMT members can benefit from free entrance to the exhibition and a 15 percent reduction on all fees for the congress, tutorials and workshops.

Get your free ticket here!


©2007/CPMT German chapter