Third Electronics System Integration Technology Conference ESTC hosted by Fraunhofer IZM

September 13-16, 2010, Berlin

With the successful conferences in Dresden (2006) and Greenwich (2008), the Electronics System Integration Technology Conference has established itself as one of Europe’s most important packaging events. The third ESTC conference will be taking place at the Maritim pro arte Hotel in Berlin from September 13-16, 2010.

ESTC 2010 will bring you up to date on the latest international developments in microsystem technology and electronic packaging. It will feature a powerful technical program, as well as professional short courses on state-of-the-art technologies. The technological focus of the conference is on:

• Advanced packaging
• New materials and processes
• Modelling and simulation
• Applied reliability
• Optoelectronics
• Assembly and manufacturing
• Power electronics.

The call for papers will we published in October 2009, deadline for the submission of abstracts is February 2010.

4th EURIPIDES Forum in Paris, France

September 30th – October 1st 2010, Paris

The fourth EURIPIDES Forum will be taking place in Paris from September 30 - October 1. Just like the predecessor events in Versailles (2007), Berlin (2008) and Barcelona (2009) it will provide a forum for developers, manufacturers and users of microsystem technology to catch up on the latest development trends in microelectronic packaging and exchange project ideas.

EURIPIDES is the European Cluster of Electronic Packaging and Integration of Microdevices and Smart Systems. This year’s Forum is organised by the EURIPIDES Office in Paris. Besides presentations on currents trends and roadmaps, the focus of the event will be on setting up new cooperation projects between European companies. Various companies will present so-called “Expressions of Interest”, introducing project proposals on topics ranging from automotive applications to medical engineering.