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3D Heterointegration
How can multi-sensor modules be even further miniaturized at considerably reduced manufacturing cost? The recently published report "3D Packaging Technology" gives a comprehensive overview of modular approaches of hetero integration that will be of utmost importance for manufacturing processes, especially in consumer electronics and in information and communication technology.

Table of content (.pdf)

Cost: 195.00€ (net), CPMT members 165€ (net)

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	::News::
	Third Electronics System Integration Technology Conference ESTC hosted by Fraunhofer IZM The Electronics System Integration Technology Conference has established itself as one of Europe’s most important packaging events. The third ESTC conference will be taking place at the Maritim pro arte Hotel in Berlin from September 13-16, 2010. more... 3D Heterointegration How can multi-sensor modules be even further miniaturized at considerably reduced manufacturing cost? more... Fraunhofer IZM’s Rolf Aschenbrenner is new CPMT president IZM-scientist Rolf Aschenbrenner has been elected president of the IEEE CPMT Board of Governors. The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of advances in microsystems packaging and manufacture. more...