3D Heterointegration
How can multi-sensor modules be even further miniaturized at considerably reduced manufacturing cost? The recently published report "3D Packaging Technology" gives a comprehensive overview of modular approaches of hetero integration that will be of utmost importance for manufacturing processes, especially in consumer electronics and in information and communication technology.
Table of content (.pdf)
Cost: 195.00€ (net), CPMT members 165€ (net)
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