Third Electronics System Integration Technology Conference ESTC hosted by Fraunhofer IZM
With the successful conferences in Dresden (2006) and Greenwich (2008), the Electronics System Integration Technology Conference has established itself as one of Europe’s most important packaging events. The third ESTC conference will be taking place at the Maritim pro arte Hotel in Berlin from September 13-16, 2010.
ESTC 2010 will bring you up to date on the latest international developments in microsystem technology and electronic packaging. It will feature a powerful technical program, as well as professional short courses on state-of-the-art technologies. The technological focus of the conference is on:
- Advanced packaging
- New materials and processes
- Modelling and simulation
- Applied reliability
- Optoelectronics
- Assembly and manufacturing
- Power electronics.
The call for papers will we published in October 2009, deadline for the submission of abstracts is February 2010.